| Memory voltage | 1.2,1.35 V |
| Cooling type | Heatsink |
| Intel Extreme Memory Profile (XMP) | Yes |
| SPD speed | 2133 MHz |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory voltage | 1.2,1.35 V |
| Cooling type | Heatsink |
| Intel Extreme Memory Profile (XMP) | Yes |
| SPD speed | 2133 MHz |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
Designed For High Performance Overclocking VENGEANCE LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the custom performance PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for peak performance potential. Compatibility Tested Part of our exhaustive testing process includes performance and compatibility testing on nearly every motherboard on the market – and a few that aren’t. XMP 2.0 Support One setting is all it takes to automatically adjust to the fastest safe speed for your VENGEANCE LPX kit. You’ll get amazing, reliable performance without lockups or other strange behavior. Aluminum Heat Spreader Overclocking overhead is limited by operating temperature. The unique design of the VENGEANCE LPX heat spreader optimally pulls heat away from the ICs and into your system’s cooling path, so you can push it harder.
Designed For High Performance Overclocking VENGEANCE LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the custom performance PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for peak performance potential. Compatibility Tested Part of our exhaustive testing process includes performance and compatibility testing on nearly every motherboard on the market – and a few that aren’t. XMP 2.0 Support One setting is all it takes to automatically adjust to the fastest safe speed for your VENGEANCE LPX kit. You’ll get amazing, reliable performance without lockups or other strange behavior. Aluminum Heat Spreader Overclocking overhead is limited by operating temperature. The unique design of the VENGEANCE LPX heat spreader optimally pulls heat away from the ICs and into your system’s cooling path, so you can push it harder.
Designed For High Performance Overclocking VENGEANCE LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the custom performance PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for peak performance potential. Compatibility Tested Part of our exhaustive testing process includes performance and compatibility testing on nearly every motherboard on the market – and a few that aren’t. XMP 2.0 Support One setting is all it takes to automatically adjust to the fastest safe speed for your VENGEANCE LPX kit. You’ll get amazing, reliable performance without lockups or other strange behavior. Aluminum Heat Spreader Overclocking overhead is limited by operating temperature. The unique design of the VENGEANCE LPX heat spreader optimally pulls heat away from the ICs and into your system’s cooling path, so you can push it harder.
Designed For High Performance Overclocking VENGEANCE LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the custom performance PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for peak performance potential. Compatibility Tested Part of our exhaustive testing process includes performance and compatibility testing on nearly every motherboard on the market – and a few that aren’t. XMP 2.0 Support One setting is all it takes to automatically adjust to the fastest safe speed for your VENGEANCE LPX kit. You’ll get amazing, reliable performance without lockups or other strange behavior. Aluminum Heat Spreader Overclocking overhead is limited by operating temperature. The unique design of the VENGEANCE LPX heat spreader optimally pulls heat away from the ICs and into your system’s cooling path, so you can push it harder.
